Chip Quik TS391SNL250, Thermally Stable Solder Paste, No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (250g jar)

Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free SAC305 in 250g jar.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Content: 88.5% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 217-220C (423-428F)
Size: 250g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use.

Technical Data Sheet

Safety Data Sheet